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Common ABS and PC bonding TPE and TPR materials

A general-purpose thermoplastic elastomer/rubber material that can form good adhesion to both ABS and Polycarbonate (PC) substrates.

  • Product Description
  • 概要
  • Item

    Description

    Product Name

    Common ABS & PC Bonding TPE/TPR Material

    Product Description

    A general-purpose thermoplastic elastomer/rubber material that can form good adhesion to both ABS and Polycarbonate (PC) substrates.

    Key Characteristics

    1. Good Adhesion to Both ABS & PC: Versatile.
    2. Provides Comfortable Soft Touch & Anti-slip: Improves hand feel.
    3. TPE/TPR Option: TPE often offers wider hardness range and more stable processing; TPR may provide a softer feel.

    Main Applications

    Overmolded electronics/appliance housings containing both ABS & PC parts, tool handles, automotive interior parts, soft-touch components in consumer goods.

    Processing Methods

    Two-shot Molding (Overmolding), Bi-injection Molding, Insert Molding.

    Environmental Certifications

    ROHS, REACH, Halogen-free (optional).

    Color

    Common colors like black, gray, customizable.

    Storage Conditions

    Store sealed in a cool, dry place. Prevent moisture absorption.

    Packaging

    25/20 kg/bag

    Core Performance

    Test Item

    Typical Requirement/Result

    Test Method

    Peel Strength to ABS & PC

    Substrate/material failure or high strength

    Custom peel test

    Hardness (Common)

    Shore A 40 - 80

    ASTM D2240

    Tensile Strength

    ≥ 5 MPa

    ASTM D412

    Suggested Molding Conditions

    Item

    Parameter/Guideline

    Drying

    80-90°C / 3-4 hours (Mandatory, especially when PC is involved)

    Melt Temperature

    170-200°C (Adjust per specific grade)

    Substrate (ABS/PC) Preheating

    Recommended 80-110°C (Key process to enhance bonding)

    Mold Temperature

    40-70°C

    Critical Precautions

    1. Generality vs. Specificity: This is a general bonding grade. For critical applications requiring ultimate bond strength, prioritize grades dedicated to a single substrate (e.g., for ABS or for PC).
    2. Substrate Identification & Cleanliness: Ensure the substrates to be bonded are indeed ABS or PC, and surfaces are clean and uncontaminated.
    3. Moisture Control: Strict drying procedure is mandatory if PC substrate is involved.


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