Common ABS and PC bonding TPE and TPR materials
A general-purpose thermoplastic elastomer/rubber material that can form good adhesion to both ABS and Polycarbonate (PC) substrates.
Category:
- Product Description
- 概要
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Item
Description
Product Name
Common ABS & PC Bonding TPE/TPR Material
Product Description
A general-purpose thermoplastic elastomer/rubber material that can form good adhesion to both ABS and Polycarbonate (PC) substrates.
Key Characteristics
1. Good Adhesion to Both ABS & PC: Versatile.
2. Provides Comfortable Soft Touch & Anti-slip: Improves hand feel.
3. TPE/TPR Option: TPE often offers wider hardness range and more stable processing; TPR may provide a softer feel.Main Applications
Overmolded electronics/appliance housings containing both ABS & PC parts, tool handles, automotive interior parts, soft-touch components in consumer goods.
Processing Methods
Two-shot Molding (Overmolding), Bi-injection Molding, Insert Molding.
Environmental Certifications
ROHS, REACH, Halogen-free (optional).
Color
Common colors like black, gray, customizable.
Storage Conditions
Store sealed in a cool, dry place. Prevent moisture absorption.
Packaging
25/20 kg/bag
Core Performance
Test Item
Typical Requirement/Result
Test Method
Peel Strength to ABS & PC
Substrate/material failure or high strength
Custom peel test
Hardness (Common)
Shore A 40 - 80
ASTM D2240
Tensile Strength
≥ 5 MPa
ASTM D412
Suggested Molding Conditions
Item
Parameter/Guideline Drying
80-90°C / 3-4 hours (Mandatory, especially when PC is involved) Melt Temperature
170-200°C (Adjust per specific grade) Substrate (ABS/PC) Preheating
Recommended 80-110°C (Key process to enhance bonding) Mold Temperature
40-70°C Critical Precautions
1. Generality vs. Specificity: This is a general bonding grade. For critical applications requiring ultimate bond strength, prioritize grades dedicated to a single substrate (e.g., for ABS or for PC).
2. Substrate Identification & Cleanliness: Ensure the substrates to be bonded are indeed ABS or PC, and surfaces are clean and uncontaminated.
3. Moisture Control: Strict drying procedure is mandatory if PC substrate is involved.
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